The International Symposium on Physical Design provides a premier forum to exchange ideas and promote research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including its interactions with architecture, behavioral- and logic-level synthesis, and back-end performance analysis and verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs, regular fabrics, FPGAs, and systems-on-chip/systems-in-package. Following its twenty-five predecessors, the 2017 symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field. The ACM Press will publish accepted papers in the Symposium proceedings. ISPD will recognize excellent contributions through a Best Paper Award. There will also be a special issue in ACM TODAES for ISPD 2017 papers. Topics of interest include but are not limited to: - Floorplanning and interconnect planning - Interactions with system and logic level design - Partitioning, placement and routing - Analysis and management of power dissipation - Physical design for manufacturability and yield - Management of design data and constraints - Synthesis optimizations within physical design - New physical design methodologies - Estimation and modeling Physical design for FPGAs - Timing and crosstalk issues in physical design - Circuit performance measurements in a PD context - Special structures for clocking and power networks - Multithreaded/distributed algorithms for physical design - Physical design for emerging process technologies - Hardware security related physical design