Microscale Enabled Advanced Flow and Heat Transfer Technologies for High Performance and Low Power Consumption
摘要截稿:
全文截稿: 2024-09-01
影响因子: 4.725
期刊难度:
CCF分类: 无
中科院JCR分区:
• 大类 : 工程技术 - 2区
• 小类 : 能源与燃料 - 2区
• 小类 : 工程:机械 - 2区
• 小类 : 力学 - 2区
• 小类 : 热力学 - 2区
Overview
The current and future capability of electronic devices relies on the continued development of their high performance, which introduces tremendous challenges in thermal management. With the conventional heat transfer methods incapable of addressing this issue, developing novel advanced heat transfer solutions is urgently needed. This special issue aims to gather cutting-edge research extending these limitations using various techniques, including but not limited to morphological optimizations for high heat transfer performance and low flow resistance reduction, surface modification methods for enhanced heat transfer, application of multiphase physics, and active/passive control for further performance enhancement.
Guest editors:
Ali SadaghianiSabanci University, Istanbul, Turkey
Hongwei WuUniversity of Hertfordshire, Hatfield, United Kingdom
Manuscript submission information:
Manuscript submission deadline: 1 September 2024